The convergence of 3D printing and sensors will be covered in this presentation.Starting with sensor packaging additive manufacturing (AM) began to replace traditional injection molding and machining for faster prototyping and product development. AM then moved into high-cost niche sensors made from expensive and hard to machine alloys and implantable metals for industrial and pharmaceutical applications involving corrosive fluids, like saline solutions as well as caustic and acidic liquids, these initially included optical pressure, Coriolis mass flow and resonant density and binary chemical concentration sensors.Flexible strain gauges, force sensors and printed circuit boards have also been manufactured using AM. The number of assembly steps and components can be dramatically reduced by introducing 3D printing into the commercialization process early in the development cycle.The sensing element and parts of the housing or package can be combined into a single printed piece to reduce the cost of manufacturing. In this talk the advantages as well as design and manufacturing challenges of AM will be addressed. The various types of 3D printers will be discussed with respect to materials, defects and minimum print feature sizes.The wide spectrum of materials that can be 3D printed enables this technology to be applied to virtually all sensing areas including biotechnology. MEMS (MicroElectroMechanical Systems) wafer processing is now using AM, to fabricate complex micromachined substrates. The micromachining steps traditionally formed with wet silicon or glass etching, DRIE and wafer to wafer bonding have been demonstrated with AM. By using 3D printing, hundreds of traditional MEMS wafer fabrication steps can be eliminated from the typical MEMS wafer process. Wafer level packaging cavities, through wafer vias, cantilevers, resonators, pressure diaphragms and suspended microtubes have all been 3D printed as part of a water.