Feng Qiao
Department of Chemical Engineering, 801 Mudd Building, 500 W120th Street, New York, NY 10027
Columbia University,
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Copper nucleation during direct electroplating onto foreign substrate; Plating electrolyte additives (suppressor, leveler, accelerator, etc.) analysis; Electroplating current distribution simulation; Alloy plating methods and processes; Novel electroplating tool design; Novel electrochemical analysis method.
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