Department of Chemical Engineering,Columbia University, 801 Mudd Building 500 W120th Street, New York, NY 10027
Currently,Feng Qiao is working as a plating engineer at the R&D department of ECI Technology.
Prof. Feng Qiao received the Ph.D. degree from Department of Chemical Engineering,Columbia University, 801 Mudd Building 500 W120th Street, New York.
Feng Qiao research work was focused on investigating copper electroplating technique mainly from three aspects: copper nucleation during electroplating onto foreign substrate; electroplating current distribution simulation; and electrolyte additive aging analysis.
he has published three papers out of this research work which represent my efficient research and writing skills. Furthermore, he has multiple R&D internship experiences in several semiconductor companies such as IBM during which he diversified his research background on copper alloy plating, and gained deeper understanding on the connection between electroplating research work and industrial practice.
Copper nucleation during direct electroplating onto foreign substrate;
(2) Plating electrolyte additives (suppressor, leveler, accelerator, etc.) analysis,Electroplating current distribution simulation,Alloy plating methods and processes,Novel electroplating tool design,Novel electrochemical analysis method